New LeEco flagship phone is doing the rounds of the internet. The said phone, codenamed the Le X850 was spotted on Chinese certification website TENAA giving out its key hardware specs. LeEco is yet to formally announce the phone.

The LeEco Le X850, as per the TENAA listing comes with a 5.7-inch QHD display and a Qualcomm Snapdragon 821 processor under the hood. The phone comes with 4GB RAM and 64GB internal memory with no word on expendable storage.

The phone weighs 185 gram and measures 7.99 mm in thickness. It sports a 13-megapixel dual camera setup on the rear alongside a 16-megapixel front selfie cam. The phone is backed by a 3,900 mAh battery.

Going by the specs, the alleged Le X850 looks like a top-tier flagship phone and could be the successor to the Le Max 2. The Chinese company has been recently spreading its wings. First it entered India, and very recently it made its US debut with phones and smart Android-based TVs.

LeEco was notably the first company to ditch the standard 3.5 mm audio jack in its Le 2 and Le Max 2 phones. Both the phones instead come with a single USB Type-C connectivity port that doubles as audio out. The phones support LeEco’s proprietary Continual Digital Lossless Audio or CDLA technology that allows them to churn out lossless audio when paired with compatible headphones. This means, what you see is what you get in terms of audio output.

There is a provision to use standard 3.5mm headphones via an adapter that ships along with the box as well. However, your standard 3.5mm headphones will not be able to make use of the CDLA technology since it is integrated right into the compatible headphones.

[source;Intoday]